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reason

XINK COREShips now

The reasoning core of Physical AI.

XINK CORE enables edge devices and robots to understand context, reason locally, and generate intelligent actions without relying fully on cloud AI — from the eCV AI SoC shipping today to a dedicated LLM processor on the roadmap.

Compute modules & dev kits

Server-class AI capability in space- and power-efficient modules — drop in the core board, or start from a full development kit.

Core board product shot

XINK SOM

The drop-in robot brain

Compute
eCV SoC — quad A55 @ 1.8 GHz + M4
NPU
4.1 TOPS (@900 MHz)
Memory
4 GB LPDDR4 · 32 GB eMMC
Video
H.264 / JPEG codec
Size
40 × 55 mm
V2 dev kit with cables

XINK V2

Full-I/O development kit

Camera in
4× MIPI Rx
USB
4× USB 3.0 + 4× USB 2.0
Display
HDMI 1080p
Network
Gigabit Ethernet + M.2 Wi-Fi
Power
12 V DC
Size
177 × 134 mm
Nano board product shot

XINK NANO

Compact sensor-fusion platform

Camera in
3× MIPI Rx
USB
2× USB 3.1 A · 2× USB-C
Display
Micro-HDMI output
Network
Gigabit Ethernet + M.2 Wi-Fi
Power
12 V DC / PoE / USB-C PD
Size
105 × 80 × 32 mm

Reason at the edge

Edge LLM / VLM models run where the data is captured — private, low-latency inference that keeps working when the network doesn't. In live demos, a quantized Gemma 3 model on a XINK board understands natural-language commands, plans multi-step tasks, and drives a robot arm.

Robot arm sorting cubes, driven by an on-board LLM

The AI controller inside

At the center is the eCV AI SoC: a quad-core Arm Cortex-A55 for applications, an always-on Cortex-M4 for real-time control, and an NPU delivering up to 4.6 TOPS — with MIPI, USB 3.0, and Ethernet interfaces that fuse RGB, ToF, IMU, LiDAR, and thermal sensors on one chip.

eCV SoC macro on the core board

Next: a dedicated LLM processor

eYs3D is taping out a next-generation 28 nm LLM IC targeting efficient low-context inference — prefill and decode tuned for the edge. It completes the Sense-and-React architecture: perception and cognition operating as a single, unified edge reflex.

28 nm wafer / die concept for the LLM IC

Deployed through the Model Zoo

CORE models are versioned, converted, and shipped to devices through the platform's Model Zoo — from base model to fleet rollout in one pipeline.

The Model Zoo — versioned models ready to deploy

XINK NANO POC

The boxed XINK NANO POC — RGB + ToF vision unit
OSARM64 Ubuntu Mate 20.04
RGB sensorSTMicro VD66GY · 1124 × 1364
RGB moduleeSP776 ISP · up to 1120 × 1120 YUY2 · 100° / 57° FoV
RGB lensNewMax DS-69017 (eYs3D IP)
ToF sensorSTMicro VD55H1 · raw 672 × 2420 @ 30 fps
ToF depth84 × 100 point cloud @ 15 fps · H63.8 × V55.1 · <3 W
StoragemicroSD · eMMC
I/O2× 1c4d MIPI in · USB 3.0 Type-C · USB 2.0 Type-A · GbE · M.2 Wi-Fi · HDMI
GPIO12× GPIO — 2× I²C · 1× SPI · 2× PWM
AudioBuilt-in mic · speaker header · 3.5 mm jack
Power12 V DC jack or 5 V USB-C · out 12 / 5 / 3.3 V
SizeBox 75 × 80 × 30 mm · PCBA 75 × 60 mm

Works with the AIoT Platform

Every CORE model is managed fleet-wide: versioned in the Model Zoo, installed over the air, monitored from the dashboard.

XINK CONNECT

Bring reasoning on-device.

Talk to us about edge LLM/VLM deployment for your hardware.